Wei Wang
Ph.D. Student (started in 2021)
Rice University
Wei Wang received the B.E. degree in Electronic Information Science and Technology from Harbin Institute of Technology, Harbin, China, in 2016, and the M.S. degree in Integrated Circuit Engineering from Tsinghua University, Beijing, China, in 2019. He is currently working toward his Ph.D. degree in Electrical and Computer Engineering at Rice University, Houston, TX. His research interests include analog/RF integrated circuits design for power management.
Education
M.S. in Integrated Circuit Engineering, 2019
Tsinghua University
B.E. in Electronic Information Science and Technology, 2016
Harbin Institute of Technology
Interests
- RF
- Implant Power Delivery
Conference Papers
- A Miniature Biomedical Implant Secured by Two-Factor Authentication with Emergency Access. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
- A Spatial-Domain Compressive Sensing Photoacoustic Imager with Matrix-Vector Multiplying SAR ADC. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
- A Millimetric Batteryless Biosensing and Stimulating Implant with Magnetoelectric Power Transfer and 0.9pJ/b PWM Backscatter. 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024.
- Omnidirectional Magnetoelectric Power Transfer for Miniaturized Biomedical Implants via Active Echo. 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024.
- A 36nW CMOS Temperature Sensor with <0.1K Inaccuracy and Uniform Resolution. 2023 IEEE Symposium on VLSI Circuits, 2023.
- Magnetoeletric Backscatter Communication for Millimeter-Sized Wireless Biomedical Implants. ACM GetMobile: Mobile Computing and Communications, 2023.
- Magnetoelectric Backscatter Communication for Millimeter-Sized Wireless Biomedical Implants. ACM International Conference On Mobile Computing And Networking (MobiCom), 2022.
- A Wireless Network of 8.8mm3 Bio-Implants Featuring Adaptive Magnetoelectric Power and Multi-Access Bidirectional Telemetry. 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022.